| Feature | IPC-7095C (2008) | IPC-7095D (2019) | |---------|------------------|------------------| | Void limit for critical BGAs | ≤ 25% (all balls) | 25% general; 50% for thermal balls | | X-ray guidance | Basic | Detailed laminography + angle imaging | | HiP defect coverage | Minimal | Dedicated section with root causes | | Package types | BGA, CSP | Added wafer-level BGA (WLBGA) |
For a standard as critical as IPC-7095 (BGA Design and Assembly), accuracy is everything. Do your design a favor and reference the official, authorized version. ipc-7095 pdf
If you find an old labeled "Rev. A" from 2002, be careful. The technology has evolved drastically. Here is a brief timeline: | Feature | IPC-7095C (2008) | IPC-7095D (2019)
Section 6.4.2 provides a thermal profile graph. To reduce voids, increase the preheat soak time (90-120 seconds) to outgas flux volatiles before the solder melts. A" from 2002, be careful